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XMOS xcore.ai Overview

✓ Authorized Distributor This page explains products from XMOS Ltd. (UK). Silicon Technology Co., Ltd. is an official authorized distributor of XMOS in Japan. XMOS Official Site →
Last updated: February 2026

Power everything with a single chip
XMOS xcore® — A next-generation SoC that integrates AI, DSP, control, and I/O on a single chip
Current: xcore.ai (XU316) — Available now
Next generation: Generative System-on-Chip (GenSoC) — Planned for phased release from 2026 onward

AI, DSP, real-time control, and software-defined I/O are condensed into a single chip . The XMOS xcore® architecture dramatically reduces product development time and cost while guaranteeing nanosecond-level deterministic real-time performance . Silicon Technology Co., Ltd. provides this trusted platform, backed by more than 35 million units shipped worldwide, with Japanese-language support.

35M+
xcore® chips
cumulative shipments* Figure announced by XMOS
16cores
real-time logical cores
(2 tiles × 8)
Max.3,200MIPS
maximum processing performance
(XU316 / 800 MHz grade)
Deterministic
ultra-low latency / low jitter
timing guarantee
🔮
Next-Generation GenSoC — Planned for phased release from 2026 onward
Generative System-on-Chip (GenSoC) is a next-generation platform concept announced by XMOS. A new development experience is envisioned, including natural-language-based design assistance. The next-generation architecture is being considered for compatibility with the RISC-V ecosystem. This is a new generation of silicon separate from the current xcore.ai. Official specifications and availability timing are planned to be released in phases.Learn more →
⚙️
Deterministic real-time processing
The parallel xcore® architecture guarantees nanosecond-level timing, making it suitable for strict timing requirements in automotive and industrial applications.
💰
Significant BOM cost reduction
Replace multiple dedicated chips with a single xcore® device, reducing board area, component costs, and inventory risk.

1. What is XMOS xcore®? — Fundamental differences from conventional chips

XMOS is a semiconductor company from Bristol, UK. Its core product, the xcore® architecture fundamentally changes conventional assumptions about SoC design. In typical embedded-system design, dedicated chips are required for AI processing, audio DSP, motor control, and communication interfaces (I/O), and these must be connected with complex wiring and software.

XMOS xcore® integrates these four roles into a single programmable SoC . In addition, the Generative System-on-Chip (GenSoC) platform announced in 2025 envisions a new development experience that may include natural-language-based design assistance in the future (roadmap features under development; official availability timing will be released in phases).

💡 XMOS core value proposition

A chip that lets functions once fixed in hardware be freely defined and changed through software and AI. Even after product release, functions can be added or changed through reprogramming, protecting long-term hardware investments.

▸ xcore.ai XU316 — Key specifications and integrated architecture
xcore.ai XU316 · 2× tiles
I/O
AI / ML
DSP
CTRL
16 cores
3,200 MIPS
Software
Defined I/O
Ultra-low
latency
Max.
128 GPIO
USB 2.0
xcore.ai XU316 — 16 cores / 3,200 MIPS (800 MHz) / deterministic timing / ultra-low latency and ultra-low jitter. Up to 128 GPIO (FB265), package dependent: QF60=34, TQ128=78. Functions that traditionally required four or more chips can run in parallel on a single chip.

Comparison with conventional approaches

Comparison point Conventional multi-chip configuration XMOS xcore.ai
Development period Several months to several years Significantly shortened with xcore.ai
Number of chips AI chip + DSP + MCU + I/O controller... Completed with a single xcore® chip
Real-time performance guarantee Jitter occurs in inter-chip communication Deterministically guaranteed at nanosecond scale
Function changes after release Hardware redesign required Handled by software only
BOM cost Many components and inventory items required Significantly reduces component count

2. Current platform — xcore.ai (available now)

XMOS’s current flagship product is xcore.ai (XU316). It is a production-proven platform with more than 35 million units shipped worldwide, integrating AI, DSP, software-defined I/O, and real-time control on a single chip. It is a de facto standard in smart speakers, professional audio, and industrial IoT, and evaluation boards are available now.

✅ xcore.ai is available now

XU316 evaluation boards and production devices are available from Silicon Technology Co., Ltd. with Japanese-language support. For the next-generation Generative System-on-Chip(GenSoC) dedicated section at the bottom of this page for more information.

3. Key functions of xcore.ai (current product)

The xcore.ai platform runs four core functions in full synchronization on a single chip. Each function is executed as an independent thread and coordinated with nanosecond-level deterministic timing.

Core Function 01
🧠 AI / Machine Learning
Edge AI inference — No cloud required

Runs speech recognition, image classification, anomaly detection, and wake-word detection on-chip. It enables low-latency inference without an external AI chip while helping protect privacy. Edge AI inference performance: up to 51.2 GMACC/s (800 MHz grade)* Figure announced by XMOS

Core Function 02
🎚️ DSP — Digital signal processing
No dedicated DSP chip required

Beamforming, active noise cancellation, echo cancellation, and dereverberation can be implemented entirely in software. Ideal for smart speakers, professional audio, and in-vehicle voice systems.

Core Function 03
⚡ Software-defined I/O
Redefine I/O without hardware changes

A wide range of interfaces, including USB Audio Class 2.0, MIPI D-PHY (FB265/TQ128 only), I2S, SPI, I2C, and PDM, can be defined and changed in software. This provides flexibility for requirement changes after release.

Core Function 04
⚙️ Deterministic real-time control
Nanosecond-level timing guarantee

The xcore® parallel architecture guarantees nanosecond-level deterministic execution without interrupts. Ideal for timing-critical applications such as motor control, sensor fusion, and safety systems.

xcore.ai XVF3610 / XVF3620 XVF3800 XMOS-USB Major product families — Evaluation boards and production devices are available from Silicon Technology Co., Ltd.

xcore.ai (XU316) — Flagship multicore SoC

Integrates AI inference, DSP, USB audio, and real-time control on a single chip. Its 16-core / 2,400–3,200 MIPS deterministic architecture guarantees ultra-low latency and ultra-low jitter.

Cores
16 logical cores (2 tiles × 8 threads)
Processing performance
2,400 MIPS (600 MHz) / 3,200 MIPS (800 MHz)
Clock
600 MHz (standard) / 800 MHz (max.)
latency
Ultra-low latency — nanosecond-level guarantee
Jitter
Ultra-low jitter — deterministic timing
SRAM
1,024 KB on-chip
GPIO
Software-defined I/O (package dependent)
USB
Built-in USB 2.0 HS PHY / Audio Class 2.0
AI performance
Up to 51.2 GMACC/s (800 MHz grade)* Figure announced by XMOS
Architecture
32-bit multicore xCORE XS3 — interrupt-free
Request an evaluation board →

4. Main application areas

xcore.ai is used across applications that require both intelligence and real-time processing, from voice AI to robotics and automotive systems. It has been adopted in global smart speakers, professional audio equipment, and industrial robots, with more than 35 million units shipped.

🎙️
Voice AI / smart speakers
Beamforming, noise suppression, and wake-word detection are all processed on-chip. Widely adopted in major smart speakers.
🎵
Professional audio / USB audio
Bit-perfect performance, ultra-low latency, and multichannel synchronization. Widely adopted as an industry standard for recording equipment, mixers, and DAC/ADC products.
🤖
Robotics / industrial automation
Runs motor control, sensor fusion, and AI inference simultaneously on a single chip. Nanosecond-level deterministic processing accelerates smart factories.
🚗
Automotive systems
In-cabin voice interfaces, active noise control, and predictive maintenance. Support is also available for functional-safety-related design needs.
🏭
Industrial IoT / edge AI
Processes equipment condition monitoring and anomaly detection at the edge. Enables real-time safety without cloud communication costs.
🎧
Hearables / wearables
Ultra-low-power AI processing for earbuds, hearing aids, and smartwatches. Brings substantial intelligence to compact devices.

5. About Silicon Technology Co., Ltd.

Silicon Technology Co., Ltd. is an official authorized distributor in Japan of XMOS Ltd. (UK), providing consistent support from evaluation-board procurement to supply of production devices.

🇯🇵
Japanese-language contact point
We can assist with product selection, quotations, and ordering. Procurement support is available from introduction through mass production.
Consult us
📦
Evaluation board / sample procurement
We can quickly arrange evaluation boards and development kits, including xcore.ai (XU316), and provide support from PoC through mass production.
Request
* The technical information and specifications on this page are based on publicly available information from XMOS Ltd.; however, product specifications are subject to change without notice. For the latest information, please refer to the XMOS official website or contact Silicon Technology Co., Ltd. Performance values shown are measured under specific conditions and do not guarantee performance in all real-world environments. This page may include statements regarding future roadmaps and features under development. These represent current plans and do not guarantee final specifications or availability timing.
Products handled by Silicon Technology
XMOS xcore® product and platform lineup

🔬 Platform silicon

XMOS xcore® platform silicon family. It integrates AI, DSP, real-time control, and software-defined I/O on a single chip. This trusted platform has shipped more than 35 million units worldwide. Evaluation samples and production devices are available from Silicon Technology Co., Ltd.
* Next-generation Generative System-on-Chip (GenSoC) is planned for phased release from 2026 onward (roadmap stage).Details here →

🇯🇵 Consultation for evaluation boards and production devices

For evaluation sample requests and quotations, contact Silicon Technology Co., Ltd. We will respond promptly.

Next-generation solution — Coming 2026

Generative System-on-Chip (GenSoC)
The next-generation intelligent embedded platform defined by XMOS

In 2025, XMOS officially defined its next generation as “Generative System-on-Chip(GenSoC).”new silicon distinct from the current xcore.ai (XU316) is planned for phased release from 2026 onward (roadmap stage). A new development experience is envisioned, including natural-language-based design assistance. The next-generation architecture is being considered for compatibility with the RISC-V ecosystem. Official specifications and availability timing will be announced in phases.

✅ Current — Available now
xcore.ai (XU316)
A proven production chip. 16 cores / 2,400–3,200 MIPS. Integrates voice AI, DSP, USB audio, and real-time control on a single chip.Evaluation kit available now.
• 16 logical cores / 600–800 MHz / 2,400–3,200 MIPS • Built-in USB Audio Class 2.0 • Up to 51.2 GMACC/s (int8, 800 MHz)* Figure announced by XMOS • More than 35 million units adopted(* Figure announced by XMOS)
View product list →
Direction of evolution
🔮 Next generation — Planned for phased release from 2026 onward
GenSoC (RISC-V based)
Next-generation chip with a new architecture (roadmap). Planned to integrate AI / DSP / I/O / control / enhanced security features / power-saving optimization. Natural-language-based design assistance is under development.Currently under development.
• RISC-V-compatible ISA (planned; official specifications to be released in phases) • Enhanced security features (details to be released in phases) • High-efficiency power optimization engine • Natural-language system-design AI
Receive advance information →
GenSoC — Six next-generation integrated functions
🧠
AI inference engine
High-speed AI inference at the edge. Runs wake-word detection, speech recognition, and anomaly detection on-chip without cloud processing.
🎚️
DSP — Digital signal processing
Beamforming, AEC, ANC, and noise suppression are defined in software. No dedicated DSP chip required.
Software-defined I/O
I/O such as USB / MIPI / I2S / SPI / PDM can be freely redefined in software. Supports changes after release.
⚙️
Deterministic real-time control
Guarantees nanosecond-level timing without interrupts. A suitable platform for strict timing requirements in automotive and industrial applications (compliance with individual standards depends on design and evaluation).
🔐
Enhanced security features Planned
Conceptual feature of next-generation GenSoC. Enhanced hardware security such as secure boot and device authentication is under consideration. Details will be released in phases.
🌿
Power optimization engine NEW
A new feature of next-generation GenSoC. AI dynamically optimizes power consumption to enable long operating times for hearables, wearables, and battery-powered devices.
Next generation
RISC-V
Base architecture
Innovation enabled by RISC-V adoption

In its next-generation chip, GenSoC aims for compatibility with the RISC-V ecosystem . By increasing compatibility with an open-standard ISA, the goal is to improve ecosystem scalability, long-term support, and third-party tool compatibility (roadmap stage; official specifications to be released in phases).

Open-standard ISA Ecosystem scalability Long-term support assurance Tool compatibility
How GenSoC changes the development process — AI-based automatic design
💬
01. Describe requirements in natural language
Simply describe the required functions in natural language. No specialized expertise required.
🤖
02. AI automatically generates the configuration
Generates optimal thread placement, timing design, and code in real time.
03. Automatically verifies deterministic performance
Automatically verifies real-time constraints and timing guarantees, greatly reducing manual effort.
🔄
04. Continues evolving after shipment
Functions can be added or changed in software even after field deployment. No hardware redesign required.
🔮 GenSoC — Receive the latest information
Silicon Technology Co., Ltd. will provide the latest information and early evaluation program guidance for next-generation GenSoC, planned for phased release from 2026 onward.
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